Power chips are connected to outside circuits via product packaging, and their performance depends on the assistance of the product packaging. In high-power situations, power chips are generally packaged as power components. Chip affiliation describes the electrical connection on the upper surface of the chip, which is typically light weight aluminum bonding cable in traditional components. ^
Typical power module package cross-section
At present, business silicon carbide power components still mainly make use of the packaging modern technology of this wire-bonded traditional silicon IGBT component. They encounter issues such as huge high-frequency parasitical specifications, inadequate heat dissipation capacity, low-temperature resistance, and inadequate insulation strength, which restrict making use of silicon carbide semiconductors. The display screen of excellent performance. In order to solve these troubles and fully manipulate the substantial potential advantages of silicon carbide chips, numerous brand-new packaging modern technologies and options for silicon carbide power modules have emerged in recent years.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have developed from gold wire bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually established from gold cords to copper wires, and the driving force is price decrease; high-power gadgets have created from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to enhance item efficiency. The higher the power, the higher the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that makes use of a solid copper bridge soldered to solder to attach chips and pins. Compared to typical bonding packaging methods, Cu Clip modern technology has the following advantages:
1. The connection between the chip and the pins is made of copper sheets, which, to a specific degree, replaces the basic wire bonding approach in between the chip and the pins. Consequently, a distinct plan resistance worth, greater current circulation, and much better thermal conductivity can be gotten.
2. The lead pin welding location does not need to be silver-plated, which can totally save the price of silver plating and bad silver plating.
3. The item appearance is completely regular with typical items and is primarily made use of in web servers, mobile computer systems, batteries/drives, graphics cards, motors, power materials, and other fields.
Cu Clip has 2 bonding approaches.
All copper sheet bonding technique
Both eviction pad and the Source pad are clip-based. This bonding technique is a lot more costly and complex, but it can attain far better Rdson and better thermal results.
( copper strip)
Copper sheet plus cable bonding approach
The source pad utilizes a Clip method, and eviction utilizes a Cord technique. This bonding technique is slightly less costly than the all-copper bonding approach, conserving wafer area (relevant to extremely small gate areas). The process is simpler than the all-copper bonding approach and can get far better Rdson and much better thermal effect.
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